[IPP] 3D Device Finishing

[IPP] 3D Device Finishing

[IPP] 3D Device Finishing

Michael Sweet msweet at apple.com
Fri Jun 13 22:57:46 UTC 2014


Ira,

Wrapping, banding, laminating, coating, trimming, and potentially other traditional finishings could be applied to a 3D object, so I wouldn't dismiss this idea out of hand.

Definitely something to discuss at the next face-to-face.


On Jun 13, 2014, at 11:45 AM, Ira McDonald <blueroofmusic at gmail.com> wrote:

> Hi Paul,
> 
> Potentially, a new IPP collection attribute could hold 3D finishings.
> But directly extending the existing "finishings-col" attribute would
> be a mistake, because hardcopy finishings are orthogonal to 3D
> finishings.
> 
> Cheers,
> - Ira
> 
> 
> Ira McDonald (Musician / Software Architect)
> Co-Chair - TCG Trusted Mobility Solutions WG
> Chair - Linux Foundation Open Printing WG
> Secretary - IEEE-ISTO Printer Working Group
> Co-Chair - IEEE-ISTO PWG Internet Printing Protocol WG
> IETF Designated Expert - IPP & Printer MIB
> Blue Roof Music / High North Inc
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> 
> 
> On Thu, Jun 12, 2014 at 4:07 PM, Paul Tykodi <ptykodi at tykodi.com> wrote:
> Hi,
> 
>  
> 
> I saw this announcement today:
> 
> http://3dprint.com/5872/3d-systems-project-ara-high-speed/
> 
>  
> 
> Where we already have IPP support for hardware that performs finishing on non-3D devices, I imagine that we could probably extend our model to handle the equivalent type of hardware being mentioned in this article as well.
> 
>  
> 
> Best Regards,
> 
>  
> 
> /Paul
> 
>  
> 
> <image001.jpg>
> 
> Paul Tykodi
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> 
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> 
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> 
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> 
> Skype:
> 
> Tykodiconsultingservices
> 
>  
> 
> Co-Chair               - IEEE-ISTO PWG IPP Working Group
> 
> Vice-Chair             - IEEE-ISTO PWG Semantic Model Working Group
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_________________________________________________________
Michael Sweet, Senior Printing System Engineer, PWG Chair

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