[IPP] HP Inc. has reviewed the PWG 3D Print Job Ticket specification and has no comments

[IPP] HP Inc. has reviewed the PWG 3D Print Job Ticket specification and has no comments

[IPP] HP Inc. has reviewed the PWG 3D Print Job Ticket specification and has no comments

Kennedy, Smith (Wireless Architect) smith.kennedy at hp.com
Fri May 26 20:08:53 UTC 2017


Cheers!

Smith

/**
    Smith Kennedy
    Wireless Architect - Client Software - IPG-PPS
    Standards - IEEE ISTO PWG / Bluetooth SIG / Wi-Fi Alliance / NFC Forum / USB IF
    Chair, IEEE ISTO Printer Working Group
    HP Inc.
*/



-------------- next part --------------
A non-text attachment was scrubbed...
Name: smime.p7s
Type: application/pkcs7-signature
Size: 4241 bytes
Desc: not available
URL: <http://www.pwg.org/pipermail/ipp/attachments/20170526/bd740af7/attachment.p7s>


More information about the ipp mailing list