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Hi,<br><br>And this morning there's a link to download the two specifications<br>(Core and Materials):<br><br> <a href="http://www.3mf.io/what-is-3mf/3mf-specification/">http://www.3mf.io/what-is-3mf/3mf-specification/</a><br><br>Note that the Core spec includes (with no detail at all) a section on<br>"Print Ticket". Probably a good time for PWG organization and<br>members to engage with the new 3MF Consortium:<br><br> <a href="http://www.3mf.io/">http://www.3mf.io/</a><br><br>Cheers,<br>- Ira<br><br clear="all"><div><div class="gmail_signature"><div dir="ltr">Ira McDonald (Musician / Software Architect)<br>Co-Chair - TCG Trusted Mobility Solutions WG<br>Chair - Linux Foundation Open Printing WG<br>Secretary - IEEE-ISTO Printer Working Group<br>Co-Chair - IEEE-ISTO PWG Internet Printing Protocol WG<br>IETF Designated Expert - IPP & Printer MIB<br>Blue Roof Music / High North Inc<br><a style="color:rgb(51,51,255)" href="http://sites.google.com/site/blueroofmusic" target="_blank">http://sites.google.com/site/blueroofmusic</a><br><a style="color:rgb(102,0,204)" href="http://sites.google.com/site/highnorthinc" target="_blank">http://sites.google.com/site/highnorthinc</a><br>mailto: <a href="mailto:blueroofmusic@gmail.com" target="_blank">blueroofmusic@gmail.com</a><br>Winter 579 Park Place Saline, MI 48176 734-944-0094<br>Summer PO Box 221 Grand Marais, MI 49839 906-494-2434<br><br><div style="display:inline"></div><div style="display:inline"></div><div style="display:inline"></div><div></div><div></div><div></div><div></div></div></div></div>
<br><div class="gmail_quote">On Thu, Apr 30, 2015 at 4:44 PM, Kennedy, Smith (Wireless Architect) <span dir="ltr"><<a href="mailto:smith.kennedy@hp.com" target="_blank">smith.kennedy@hp.com</a>></span> wrote:<br><blockquote class="gmail_quote" style="margin:0 0 0 .8ex;border-left:1px #ccc solid;padding-left:1ex">Just saw this in my inbox and thought I'd share. Not sure if it is publicly viewable.<br>
> <a href="http://www.pddnet.com/news/2015/04/new-3d-printing-consortium-work-towards-unified-file-format?et_cid=4545965&et_rid=210445323&type=headline" target="_blank">http://www.pddnet.com/news/2015/04/new-3d-printing-consortium-work-towards-unified-file-format?et_cid=4545965&et_rid=210445323&type=headline</a><br>
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Smith<br>
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/**<br>
Smith Kennedy<br>
Hewlett-Packard Co.<br>
*/<br>
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</blockquote></div><br>